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INTEGRATED CIRCUITS
DATA SHEET
TDA1521 TDA1521Q 2 x 12 W hi-fi audio power amplifier
Product specification File under Integrated Circuits, IC01 July 1994
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
GENERAL DESCRIPTION
TDA1521 TDA1521Q
The TDA1521/TDA1521Q is a dual hi-fi audio power amplifier encapsulated in a 9-lead plastic power package. The device is especially designed for mains fed applications (e.g. stereo tv sound and stereo radio). Features * Requires very few external components * Input muted during power-on and off (no switch-on or switch-off clicks) * Low offset voltage between output and ground * Excellent gain balance between channels * Hi-fi according to IEC 268 and DIN 45500 * Short-circuit-proof * Thermally protected QUICK REFERENCE DATA Stereo applications Supply voltage range Output power at THD = 0,5%, VP = 16 V Voltage gain Gain balance between channels Ripple rejection Channel separation Noise output voltage PACKAGE OUTLINES TDA1521: 9 leads in-line; plastic power (SOT131); SOT131-1; 1996 August 20. TDA1521Q: 9 leads SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 August 20. PO Gv Gv SVRR Vno(rms) typ. typ. typ. typ. typ. typ. 12 30 0,2 60 70 70 W dB dB dB dB V VP 7,5 to 21,0 V
July 1994
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Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521 TDA1521Q
Fig.1 Block diagram.
PINNING 1 2 3 4 -INV1 INV1 GND OUT1 non-inverting input 1 inverting input 1 ground (symmetrical)
1 2
5 6 7 8 9
-VP OUT2 +VP INV2 -INV2
negative supply (symmetrical) ground (asymmetrical) output 2 positive supply inverting input 2 non-inverting input 2
VP (asymmetrical)
output 1
July 1994
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Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
FUNCTIONAL DESCRIPTION
TDA1521 TDA1521Q
This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and asymmetrical power supply systems. An output power of 2 x 12 watts (THD = 0,5%) can be delivered into an 8 load with a symmetrical power supply of 16 V. The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread and very good balance between the amplifiers (0,2 dB). A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off. Referring to Fig.13, the 100 F capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed reference voltage. During the delay the amplifiers remain in their DC operating mode but are isolated from the non-inverting inputs on pins 1 and 9. Two thermal protection circuits are provided, one monitors the average junction temperature and the other the instantaneous temperature of the power transistors. Both protection circuits activate at 150 C allowing safe operation to a maximum junction temperature of 150C without added distortion. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage Non-repetitive peak output current Total power dissipation Storage temperature range Junction temperature Short-circuit time: outputs short-circuited to ground (full signal drive) symmetrical power supply asymmetrical power supply; VP < 32 V (unloaded); Ri 4 Note For asymmetrical power supplies (at short circuiting of the load) the maximum supply voltage is limited to VP = 28 V. If the total internal resistance of the supply (Ri) > 4 , the maximum unloaded supply voltage is increased to 32 V. tsc - 1 hour tsc - 1 hour see note pins 4 and 6 see Fig.2 IOSM Ptot Tstg Tj -55 - +150 150 C C - 4 A CONDITIONS pin 7 pin 5 SYMBOL VP = V7-3 -VP = V5-3 - - MIN. MAX. +21 -21 V V UNIT
July 1994
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Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521 TDA1521Q
Fig.2 Power derating curve.
THERMAL RESISTANCE From junction to case HEATSINK DESIGN EXAMPLE With derating of 2,5 K/W, the value of heatsink thermal resistance is calculated as follows: given RL = 8 and VP = 16 V, the measured maximum dissipation is 14,6 W; then, for a maximum ambient temperature of 65 C, the required thermal resistance of the heatsink is 150 - 65 R th h - a = --------------------- - 2 ,5 = 3 ,3 K W 14, 6 Note: The internal metal block (heatsink) has the same potential as pin 5 (-VP). Rth j-c = 2,5 K/W
July 1994
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Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
CHARACTERISTICS PARAMETER Supply voltage range operating mode input mute mode Repetitive peak output current VP = 16 V; RL = 8 ; Tamb = 25 C; f = 1 kHz Total quiescent current Output power Total harmonic distortion Power bandwidth PO = 6 W THD = 0,5% note 1 Voltage gain Gain balance Noise output voltage (r.m.s, value); unweighted (20 Hz to 20 kHz) Input impedance Ripple rejection Channel separation Input bias current DC output offset voltage with respect to ground VOFF - 30 note 2 RS = 0 RS = 2 k Vno(rms) |Zi SVRR Iib - 14 40 46 - 70 20 60 70 0,3 B GV GV 29 - 20 to 20k 30 0,2 THD - 0,15 without RL THD = 0,5% THD = 10% Itot PO PO 18 10 12 40 12 15 IORM 2,2 - VP VP 7,5 2,0 16,0 - CONDITIONS SYMBOL MIN. TYP.
TDA1521 TDA1521Q
MAX. 21,0 5,8 - V V A
UNIT
Operating mode: symmetrical power supply; test circuit as per Fig.12; 70 - - 0,2 mA W W %
Hz 31 1,0 dB dB
140 26 - - - 200
V k dB dB A mV
Input mute mode: symmetrical power supply; test circuit as per Fig.12; VP = 4V; RL = 8 ; Tamb = 25 C; f = 1 kHz Total quiescent current Output voltage Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) Ripple rejection DC output offset voltage RS = 2 k note 2 with respect to ground VOFF - 40 200 mV Vno(rms) SVRR - 35 70 55 140 - V dB without RL Vi = 600 mV Itot Vout 9 - 30 0,6 40 1,8 mA mV
July 1994
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Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521 TDA1521Q
SYMBOL MIN. TYP. MAX. UNIT
PARAMETER
CONDITIONS
Operating mode: asymmetrical power supply; test circuit as per Fig.13; VS = 24 V; RL = 8 ; Tamb = 25 C; f = 1 kHz Total quiescent current Output power Total harmonic distortion Power bandwidth Voltage gain Gain balance Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) Input impedance Ripple rejection Channel separation Notes 1. Power bandwidth at Po max -3 dB. 2. Ripple rejection at RS = 0 , f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or negative supply rail. RS = 0 RS = 2 k Vno(rms) Zi SVRR - 14 35 - 70 20 44 45 140 26 - - V k dB dB PO = 4 W THD = 0,5% note 1 B GV GV 29 - THD - 0,13 40 to 20k 30 0,2 31 1 Hz dB dB 0,2 % THD = 0,5% THD = 10% Itot Po Po 18 5 6,5 40 6 8 70 - - mA W W
July 1994
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Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
APPLICATION INFORMATION Input mute circuit
TDA1521 TDA1521Q
The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the 1/2 supply voltage (at pin 3) with an internally fixed reference voltage (Vref), derived directly from the supply voltage. When the voltage at pin 3 is lower than Vref the non-inverting inputs (pins 1 and 9) are disconnected from the amplifier. The voltage at pin 3 is determined by an internal voltage divider and the external 100 F capacitor. During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the input terminal is disconnected, (as illustrated in Fig.3).
Fig.3 Input mute circuit; time delay.
July 1994
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Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521 TDA1521Q
Fig.4
Output power as a function of supply voltage; symmetrical supply; RL = 8 ; f = 1 kHz.
Fig.5
Distortion as a function of frequency; symmetrical supply; VP = 16 V; RL = 8 ; Po = 6 W.
Fig.6
Supply voltage ripple rejection; symmetrical supply; VP = 16 V; VRR = 200 mV. 9
Fig.7
Power dissipation as a function of output power; symmetrical supply; VP = 16 V; RL = 8 ; f = 1 kHz.
July 1994
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521 TDA1521Q
Fig.8
Output power as a function of supply voltage; asymmetrical supply; RL = 8 ; f = 1 kHz.
Fig.9
Distortion as a function of frequency; asymmetrical supply; VS = 24 V; RL = 8 ; Po = 4 W.
Fig.10 Supply voltage ripple rejection; asymmetrical supply; VS = 24 V; VRR = 200 mV. July 1994 10
Fig.11 Output power as a function of supply voltage; asymmetrical supply; RL = 4 ; f = 1 kHz.
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521 TDA1521Q
(1) To be connected as close as possible to the IC
Fig.12 Test and application circuit; symmetrical power supply.
(1) To be connected as close as possible to the IC
Fig.13 Test and application circuit; asymmetrical power supply.
July 1994
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Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
PACKAGE OUTLINES SIL9P: plastic single in-line power package; 9 leads
TDA1521 TDA1521Q
SOT131-2
non-concave x Dh
D Eh
view B: mounting base side d A2
B seating plane j E
A1 b
L
c 1 Z e bp wM 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT mm A1 max. 2.0 A2 4.6 4.2 b max. 1.1 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 Eh 6 j 3.4 3.1 L 17.2 16.5 Q 2.1 1.8 w 0.25 x 0.03 Z (1) 2.00 1.45 10 mm 9 Q
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT131-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
July 1994
12
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
TDA1521 TDA1521Q
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)
SOT157-2
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q c
1 Z e1 e bp wM
9 m e2 vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 5.08 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.25 x 0.03 Z (1) 2.00 1.45
2.54 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT157-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-12 95-03-11
July 1994
13
Philips Semiconductors
Product specification
2 x 12 W hi-fi audio power amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1521 TDA1521Q
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994
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